Virtualization has a central role in modern systems. It constitutes a key aspect in a wide range of environments, from small mobile computing devices to large-scale data centers and computational clouds. Virtualization techniques encompass the underlying hardware, the operating system, and the runtime system. While the approaches at different layers can differ dramatically, they tend to have similarities, and they must often tackle related challenges.

The 10th ACM SIGPLAN/SIGOPS International Conference on Virtual Execution Environments (VEE'14) brings together researchers and practitioners from different computer systems domains to interact and share ideas in order to advance the state of the art of virtualization and broaden its applicability. We invite authors to submit original papers related to virtualization across all layers of the software stack down to the microarchitectural level. Topics of interest include (but are not limited to):

• virtualization support for programs and programmers;
• architecture support for virtualization;
• operating system support for virtualization;
• compiler and programming language support for virtualization;
• runtime system support for virtualization;
• virtual I/O, storage, and networking;
• memory management;
• management technologies for virtual environments;
• performance analysis and debugging for virtual environments; and
• virtualization technologies applied to specific problem domains such as cloud, HPC, realtime, power management, and security.

As usual (since 2008), VEE 2014 is co-located with ASPLOS 2014, which will take place in Salt Lake City, UT. VEE'14 will be held concurrently with the ASPLOS'14 workshops, during March 1-2, 2014. Registration for VEE'14 is available as an option within the ASPLOS'14 online registration system. Hotel arrangements can likewise be made according to the directions on the ASPLOS'14 page. VEE'14 attendees are permitted to attend all ASPLOS'14 workshops.

Please submit your paper through this link after reading the following submission instructions.

Submissions must attack an interesting problem and clearly articulate their contribution relative to previous work. Submissions must be in ACM SIGPLAN proceedings format, 10-point type, and they may not exceed 12 pages, all inclusive. Word and LaTeX templates for this format are available at http://www.sigplan.org/authorInformation.htm (but please note that 10-point is not the default). Pages must be numbered, and submissions must be in PDF, legible when printed black and white on US Letter and A4 paper. All fonts must be embedded in the submitted PDF.

Reviewing will be double blind. So submissions must be anonymous. Author names, affiliations, acknowledgments, and any other hints of identity must not be included in the submission. You should not anonymize your bibliographic references; instead, cite your work in the third person so that your submission is self-contained. Make a good-faith effort to conceal any authorship connection between prior work and yours.

Submissions must describe unpublished work that is not currently submitted for publication elsewhere as discussed at http://www.sigplan.org/Resources/Policies/Republication. Authors of accepted papers will be required to sign an ACM copyright release. The proceedings will be published by ACM.

Make sure that your paper satisfies all the above requirements for content and format before submission; if you have a question about any of these issues, please send email to the program chairs, Erez Petrank and Dan Tsafrir.

Partial travel grants are available from both SIGPLAN and SIGOPS for students who are co-authors of a VEE'14 paper. Student can apply for a travel grant via two channels:

• To apply for a SIGOPS grant, please email Martin Hirzel with the following information: (1) your name, university, and advisor; (2) the title of your VEE'14 paper; and (3) your detailed travel budget, including cost sharing information. Also, please ask your advisor to send an endorsement letter to Martin Hirzel that confirms your budget.
  
  
• To apply for a SIGPLAN grant, please use the SIGPLAN PAC web page.

    

Please contact Dan Tsafrir with any questions about this site. Last update: 6 Feb, 2014.